DLP® 2021-Q1 S249 (PCBeam™ 56 Position LGA/LGA Low-Height Connector)
DLP® 2021-Q1 S249 (PCBeam™ 56 Position LGA/LGA Low-Height Connector)Jan Li2023-09-14T16:51:49+00:00
The PCBeam™ 56 Position Connector is an ultra-low profile interconnect solution for the Texas Instruments Automotive DLP2021-Q1 (S249 DMD, 0.20 16:9 FQU) for use in applications requiring minimal Z-Axis height. The incredibly low 0.55mm (0.022”) mated height is approximately 58% reduction in height compared to standard height DMD interconnect solutions.
This one-piece, high density and cost effective solution is enabled by Neoconix’s patented PCBeam™ technology providing both a heat-sink opening and feaures for precise alignment of the Interposer to the DMD and main PC Board.
High density 1.00mm area-array pitch
Ultra-low profile, 0.55mm mated height
PCBeam™ high reliability LGA spring contacts
Single piece frame for improved dimensional tolerances