LGA Sockets are targeted for silicon ICs packaged using a Land Grid Array (LGA) package. Ideal for embedded CPU applications, Module to Board, Multi-Chip Modules (MCM) and custom ASIC applications in low to mid-range volumes. Typically, this solution is used to provide the capability to mate and de-mate IC packages during prototyping, rework, and to preserve investment in IC and/or PCBs. LGA sockets products from Neoconix may be rapidly customized for an application’s specific requirements.
Large arrays -up to 8000 contacts
PCB based for flexibility in thickness, shape & size