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LGA/BGA Hybrid and LGA/Pad

LGA/BGA Hybrid and LGA/PadJan Li2019-06-11T21:11:19+00:00
LGA/BGA
LGA/PAD

Traditional Interposers are configured with a compression interface on each surface (LGA/LGA). In addition, Neoconix offers two surface mount options utilizing PCBeam™ technology (LGA/BGA) and (LGA/PAD).

Solder balls (LGA/BGA) are attached to the bottom side of the interposer as if it were an organic ball grid array (BGA) package. A land pattern (LGA/Pad) can also be implemented.

PCBeam™ contact technology offers engineers design versatility featuring fine pitch and low profile options as well as high performance, rugged interconnects for Board-to-Board, Flex-to-Board and Device-to-Board applications.

Product Features

  • High speed 10Gbps
    ▪ Road map 28Gbps
  • Minimum pitch 0.74mm
  • PCB based for flexibility in thickness, shape & size
  • Large arrays 5K contacts
  • Grid/Irregular patterns
  • High volume
  • Protective caps
  • Shock/Vibration 1500g’s
  • RoHS 2011/65/EU
  • Halogen-free

Related

  • PCBeam™ Technology
  • PCBeam™ LPS Connector
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