LGA/BGA Hybrid and LGA/PadJan Li2019-06-11T21:11:19+00:00
Traditional Interposers are configured with a compression interface on each surface (LGA/LGA). In addition, Neoconix offers two surface mount options utilizing PCBeam™ technology (LGA/BGA) and (LGA/PAD).
Solder balls (LGA/BGA) are attached to the bottom side of the interposer as if it were an organic ball grid array (BGA) package. A land pattern (LGA/Pad) can also be implemented.
PCBeam™ contact technology offers engineers design versatility featuring fine pitch and low profile options as well as high performance, rugged interconnects for Board-to-Board, Flex-to-Board and Device-to-Board applications.
High speed 10Gbps ▪ Road map 28Gbps
Minimum pitch 0.74mm
PCB based for flexibility in thickness, shape & size