High Pin Count LGA Connectors for High Performance Computing
High Pin Count LGA Connectors for High Performance ComputingJan Li2022-11-12T06:14:31+00:00
HPC computing in support of AI and Machining Learning is driving integrated packaging to new levels of performance both in signal speeds and power ratings. Similarly, rapidly increasing bandwidth demands in advanced switches and routers in data centers is also pushing packaging into higher limits of capability. In turn, packaging sizes are dramatically increasing with corresponding pin counts expanding to support multiple lanes of high-speed signaling, other IO signals and power (W). Pin counts in excess of 5000 & power needs into the kilowatts range is rapidly becoming the norm in next generation systems. Neoconix interposer solutions stand at the forefront of high density interconnect.
At Neoconix, we take a unique approach to LGA Socket & Board to Board (B2B) technology by combining Printed Circuit Board (PCB) manufacturing with photolithography etched high-performance copper-alloy contacts to offer superior performance and scalability.