PCBeam™ interconnect technology adds a 3rd dimension (Z-axis) to traditional two-dimensional printed circuit board (PCB) processing. Metal contact elements (springs) emanate from one or two sides of high performance PCB materials resulting in a simple, yet highly customizable, one-piece connector body. The photolithography and etch-based manufacturing processes provides excellent dimensional control compared to traditional stamping and molding. The process is scalable to very fine feature size for space constrained applications. Without molds, PCBeam™ connectors offer unparalleled design flexibility and short lead times for a vast array of custom parts.
Customers experience design versatility of fine pitch and low profile options as well as high performance, rugged interconnects for Board-to-Board, Flex-to-Board and Device-to-Board applications. PCBeam™ technology is protected by a strong IP portfolio including over 60 patents (issued and pending).
High speed 10Gbps ▪ Road map 28Gbps
Minimum pitch 0.74mm
PCB based for flexibility in thickness, shape & size