Skip to content
info@neoconix.com   408 530 9393
Re-inventing the Interconnect Industry
Neoconix™ PCB Connectors & Interposers – High Performance Logo
  • Product Types
    • PCB Board-to-Board Connectors & Interposers
    • FPC-to-Board Connectors
    • Device-to-Board Connectors
    • High Speed Connectors
    • FPC Connector Assemblies
    • High Pin Count Connectors
    • LGA Sockets
    • Battery Connectors
  • Product Families
    • Mobile/Consumer Standard Products
      • PCBeam™ LPM Connectors (Signal + Power)
      • PCBeam™ LPS Connectors (LGA/BGA)
      • X-Beam™ FPC Connectors
      • PCBeam™ SPH1 Connectors
      • PCBeam™ SPH2 Connector
    • High Speed Products
      • Y-Beam™ Technology
      • DLBeam™ Technology
    • FPC Connector Assemblies
      • FPConnected™ PFPC (LPM FPC Jumper)
      • FPConnected™ XFPC (X-Beam FPC Jumper)
      • FPConnected™ USB 3.2 (USB 3.2 FPC Bridge)
      • FPConnected™ FX-Beam (Integrated FPC Jumper)
    • Connectors for DLP® Products
      • DLP® 3010 S245 (PCBeam™ 57 Position LGA/LGA Connector)
      • DLP® 3010 S245 (PCBeam™ 57 Position LGA/LGA Low Height Connector)
      • DLP® 230 S246 (PCBeam™ 54 Position LGA/LGA Connector)
      • DLP® 230 S246 (PCBeam™ 54 Position LGA/LGA Low-Height Connector)
      • DLP® 3021-Q1 S247 (PCBeam™ 56 Position LGA/LGA Connector)
      • DLP® 160 S248 (PCBeam™ 35 Position LGA/LGA Low Height Connector)
      • DLP® 160 S248 (PCBeam™ 35 Position LGA/LGA Connector)
      • DLP® 2021-Q1 S249 (PCBeam™ 56 Position LGA/LGA Low-Height Connector)
      • DLP® 4500 S310 & S311 (PCBeam™ 40 Position LGA/BGA Connector)
      • DLP® 4710 S312 (PCBeam™ 100 Position LGA/LGA Connector)
      • DLP® 3310 S315 (PCBeam™ 92 Position LGA/LGA Connector)
      • DLP® 470TP S316 & 471TP S317 (PCBeam™ 250 Position LGA/LGA Connector)
    • Custom Connectors & Interposers
      • High Pin Count LGA Connectors for High Performance Computing
      • Custom PCBeam LGA Sockets
      • PCBeam™ Battery Connectors
      • High Speed Products
  • Technology
    • PCBeam™ Technology
    • DLBeam™ Technology
    • Y-Beam™ Technology
    • X-Beam™ Technology
    • Dual Beam Technology
    • LGA/BGA Hybrid & LGA/Pad
  • Company
    • About Us
    • Markets/Applications
    • News
    • Careers
    • Terms & Conditions of Sale
    • Contact Us
    • FAQ
  • Contact Us
  • Request a Quote

DLBeam™ Technology

DLBeam™ TechnologyJan Li2019-06-11T20:16:07+00:00

Engineered specifically for high speed, DLBeam™ construction offers enhanced signal integrity for applications up to 56Gbps. Utilizing a modified design and manufacturing flow, DLBeam™ products take advantage of 60% less surface area to significantly reduce parasitic capacitance. The design also features a shorter, more direct signal path to minimize attenuation.

The DLBeam™ interposer construction is offered at 1mm pitch or greater. DLBeam™ products are offered in thicknesses from 0.75mm – 3.5mm and with LGA/LGA or LGA/BGA configurations. The coreless DLBeam™ option has a standard thickness of 0.45mm, with capability down to 0.30mm offered in LGA/LGA configuration.

Product Features

  • High speed 28Gbps
    ▪ Road map 56Gbps
  • Pitch 1.0mm, 1.27mm, 2mm
  • Low insertion loss
  • Low profile 0.30mm
  • Up to 3.5mm height
  • Current capacity >2A per single position
  • Separable LGA/LGA or solderable LGA/BGA
  • RoHS 2011/65/EU
  • Halogon-free

Related

  • Custom Connectors
  • Y-Beam™ Technology
  • PCBeam™ Technology
  • Quote Request Form
  • Request Information

About Us

Markets/Applications

News

Careers

Terms & Conditions of Sale

Contact Us

FAQ

https://neoconix.com/wp-content/uploads/Neoconix-Inc.mp4

Recent Posts

  • Neoconix Expands FPConnected™ Portfolio with Introduction of “Water-Resistant” IP67 Rated USB3.2 Type-C Integrated Connector-FPC Bridge Solution
  • Neoconix Expands FPConnected™ Portfolio with Introduction of FX-Beam™ Integrated Connector-FPC Solution
  • Samsung Seminar
Copyright 2019 | All Rights Reserved |
Page load link
Go to Top