Engineered specifically for high speed, DLBeam™ construction offers enhanced signal integrity for applications up to 56Gbps. Utilizing a modified design and manufacturing flow, DLBeam™ products take advantage of 60% less surface area to significantly reduce parasitic capacitance. The design also features a shorter, more direct signal path to minimize attenuation.
The DLBeam™ interposer construction is offered at 1mm pitch or greater. DLBeam™ products are offered in thicknesses from 0.75mm – 3.5mm and with LGA/LGA or LGA/BGA configurations. The coreless DLBeam™ option has a standard thickness of 0.45mm, with capability down to 0.30mm offered in LGA/LGA configuration.
- High speed 28Gbps
▪ Road map 56Gbps
- Pitch 1.0mm, 1.27mm, 2mm
- Low insertion loss
- Low profile 0.30mm
- Up to 3.5mm height
- Current capacity >2A per single position
- Separable LGA/LGA or solderable LGA/BGA
- RoHS 2011/65/EU