The PCBeam™ 56 Position Connector is an ultra-low profile interconnect solution for the Texas Instruments Automotive DLP2021-Q1 (S249 DMD, 0.20 16:9 FQU) for use in applications requiring minimal Z-Axis height. The incredibly low 0.55mm (0.022”) mated height is approximately 58% reduction in height compared to standard height DMD interconnect solutions.
This one-piece, high density and cost effective solution is enabled by Neoconix’s patented PCBeam™ technology providing both a heat-sink opening and feaures for precise alignment of the Interposer to the DMD and main PC Board.
Product Features
- High density 1.00mm area-array pitch
- Ultra-low profile, 0.55mm mated height
- PCBeam™ high reliability LGA spring contacts
- Single piece frame for improved dimensional tolerances
- Hard gold plated contact interface
- RoHS 2011/65/EU (RoHS2) compliant
- Halogen-Free
Documents
 |
Application Spec |
|
Drawing |
|
Request 3D File |