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C-Beam™ technology is an extension of PCBeam™ technology specifically developed for ultra-dense pitch (0.5mm – 0.6mm) and high-speed (up to 112Gbps) applications. The large pin counts offered enable combining numerous high speed differential pairs, power, and signals in one connector.
Utilizing a modified design and manufacturing process, C-Beam™ construction allows up to 40% reduction in pitch as compared to PCBeam™. Like PCBeam™ technology, the C-Beam™ offerings are available with extensive customizability.
Offered in low-profile (down to 1.1mm) LGA/LGA format, implementations include onboard optical modules, high speed Board-to-Board connections, and other interconnects requiring high speed and low profile.
Product Features
- High speed to 112Gbps
- 0.5mm x 0.5mm, 0.6mm x 0.6mm,scalable pitches down to 0.4mm and mixed pitches possible
- Extensive customization in size, footprint, pitch and pin count
- LGA/LGA
- Low-profile height down to 1.1mm
- RoHS 2011/65/EU
- Halogen-free
Documents
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Overview |
Related
- Custom Connectors
- C-Beam™ CBM Connectors
- C-Beam™ SPH3 Connectors
- Quote Request Form
- Request Information