This one-piece, high density connector product was developed specifically for the 310 DMD. Featuring PCBeam™ interconnect technology, this product offers high performance and high reliability in an extremely compact form factor. Solder balls are pre-attached for ease of assembly onto the target flex circuit or rigid circuit board.
Product Features
- Standard design
- Pitch 0.74mm
- LGA/BGA
- Low profile 1.06mm mate
- PCBeam™ contacts
- Hard gold plated interface
- SMT assembly
- High volume tooled
- Short lead times
- Free samples
- IPS-4101B Halogen-free
- RoHS 2011/65/EU
Documents
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Application Spec |
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Drawing |
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Request 3D File |