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LGA/BGA |
| LGA/PAD |  |
Traditional Interposers are configured with a compression interface on each surface (LGA/LGA). In addition, Neoconix offers two surface mount options utilizing PCBeam™ technology (LGA/BGA) and (LGA/PAD).
Solder balls (LGA/BGA) are attached to the bottom side of the interposer as if it were an organic ball grid array (BGA) package. A land pattern (LGA/Pad) can also be implemented.
PCBeam™ contact technology offers engineers design versatility featuring fine pitch and low profile options as well as high performance, rugged interconnects for Board-to-Board, Flex-to-Board and Device-to-Board applications.
Product Features
- High speed 10Gbps
▪ Road map 28Gbps - Minimum pitch 0.74mm
- PCB based for flexibility in thickness, shape & size
- Large arrays 5K contacts
- Grid/Irregular patterns
- High volume
- Protective caps
- Shock/Vibration 1500g’s
- RoHS 2011/65/EU
- Halogen-free