HPC computing in support of AI and Machining Learning is driving integrated packaging to new levels of performance both in signal speeds and power ratings. Similarly, rapidly increasing bandwidth demands in advanced switches and routers in data centers is also pushing packaging into higher limits of capability. In turn, packaging sizes are dramatically increasing with corresponding pin counts expanding to support multiple lanes of high-speed signaling, other IO signals and power (W). Pin counts in excess of 5000 & power needs into the kilowatts range is rapidly becoming the norm in next generation systems. Neoconix interposer solutions stand at the forefront of high density interconnect.
At Neoconix, we take a unique approach to LGA Socket & Board to Board (B2B) technology by combining Printed Circuit Board (PCB) manufacturing with photolithography etched high-performance copper-alloy contacts to offer superior performance and scalability.

NCX Technology Pitch (mm) X x Y Interstitial Pitch Degree of customization Performance
PCBeam™ 0.8, 1.0, 1.27, custom Various Highest 56G PAM4, PCIe Gen 4/5, DDR5
Y-Beam™ 0.8 x 1.0, 1.00 & 0.8 x 1.27, custom High 112G PAM4, PCIe Gen 4/5, DDR5

For more information contact Neoconix at info@neoconix.com.

Product Features

  • Scalable
    • Up to 10K+ contacts
    • 120mm+ in size
  • Ultra-thin capabilities to 0.5mm providing ultra-short electrical path
  • Board to Board (B2B) supporting up to 4mm thickness
  • Superior Electrical Performance
    • 112G PAM4
    • PCIe Gen 4/5
    • DDR5
  • Grid or irregular contact patterns
  • PCB & Photolithography based Manufacturing offers
    • Reduced capital investment vs traditional molded housing approach
    • CTE matched to PCB’s
    • Improved contact true positioning
    • High degree of customization
  • RoHS 2011/65/EU
  • Halogen-free
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