Neoconix Incorporated, the leader in advanced miniaturized low-profile electrical connectors is proud to announce it has now shipped over 1 billion contacts. With over 10 years of research and development and 60 patents (issued or pending), Neoconix has experienced significant customer adoption of its PCBeamTM technology within high growth markets such as Consumer Electronics and Mobile as well as traditional markets […]
Neoconix Incorporated, the leader in miniaturized low-profile electrical connectors has entered into an investment and supply agreement with longtime partner Unimicron Technology Corporation (“Unimicron”) (TAIEX: 3037), one of the world’s largest PCB manufacturers. This investment strengthens Neoconix operations by providing dedicated production and engineering […]
TMC announced today that Neoconix, www.neoconix.com, which leverages lithography to enable high-performance connectors, has joined Wearable Tech Conference & Expo as an exhibitor. The event, December 10-11 at the Hilton Los Angeles/ Universal City, features a series of sessions and demonstrations that focus on the present and future of wearable technology […]
Neoconix has been named to The Wall Street Journal’s The Next Big Thing list, which seeks to identify and rank venture-backed companies across all industries that have the capital, executive experience and investor know-how to succeed. Neoconix was selected from a pool of nearly 6,000 companies and ranked based on proprietary data from Dow Jones VentureSource and input from Dow Jones VentureWire’s reporters and editors. […]
Neoconix announced today immediate availability of its new compression connector products specifically targeted at mobile electronics applications such as notebooks, digital still cameras, tablets and mobile phone handsets. The products combine fine pitch PCBeam™ contact technology along with screw or surface mount clamping […]
Neoconix has announced immediate availability of its new SPH1 family of compression connector products for flex-to-board and board-to-board applications. Utilizing PCBeam™ connector technology, these products combine high density and high reliability with outstanding electrical performance. […]
Neoconix PCBeam ™ Technology is presented in the feature article of the March/April publication of Advancing Microelectronics magazine. The feature article, titled “Freedom of Design – Custom, High Reliability Connectors with Low Cost Tooling,” presents a background on PCBeam Connector Technology before detailing the wide spectrum of new connector design options […]
Neoconix announced today that their high volume manufacturing site in Shenzhen, China has been fully qualified. The Shenzhen plant is now shipping multiple connector products to leading OEMs for computing and mobile consumer products. The Shenzhen factory is operated by Unimicron Corporation, one of the world’s largest and most respected printed circuit board and substrate manufacturers. The factory utilizes cost-effective, large format panel manufacturing and automated, state of the art equipment to greatly increase manufacturing capacity and capability for Neoconix […]
Neoconix has teamed up with Intel to develop a low-profile socket alternative for Intel’s Jasper Forest family of processors based on the Nehalem-EP architecture. The new Neoconix socket allows Intel’s customers to maximize the performance and power advantages of this new architecture. The new low-profile socket from Neoconix supports Intel’s LGA1366 footprint and offers a 50% reduction in mated height […]
Neoconix will be presenting a new white paper at SMTA International 2009. Titled “Assessing Design Tradeoffs with a Customizable Area-Array Connector,” the presentation will discuss ways to influence the mechanical and electrical properties of connectors by taking advantage of the greatly expanded designflexibility of PCBeam™ Connector Technology. Effects of various design choices will be quantified through empirical measurements […]
