LGA Sockets are targeted for silicon ICs packaged using a Land Grid Array (LGA) package. Ideal for embedded CPU applications, Module to Board, Multi-Chip Modules (MCM) and custom ASIC applications in low to mid-range volumes. Typically, this solution is used to provide the capability to mate and de-mate IC packages during prototyping, rework, and to preserve investment in IC and/or PCBs. LGA sockets products from Neoconix may be rapidly customized for an application’s specific requirements.

Product Features

  • Large arrays -up to 2000 contacts
  • PCB based for flexibility in thickness, shape & size
  • Thickness to 4mm
  • Minimum pitch 0.74mm
  • Grid or irregular contact patterns
  •  LGA/LGA or LGA/BGA
  • High volume manufacturability
  •  Superior shock & vibration to 1500g’s
  • High current capacity
  • CTE matching & signal routing
  • High speed 56+Gbps
  • RoHS 2011/65/EU
  • Halogen-free

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