Neoconix Partners with Molex on High-Density and Speed Electrical Interconnect
Neoconix and Molex have partnered to deliver a flexible, copper-based high-density and speed (HD&S) electrical interconnect. The low-profile interconnect integrates Neoconix PCBeam™ based interposer with Molex’s Copper Flex technology. This integrated interconnect solution is designed to deliver the industry’s best overall performance with unprecedented design flexibility, critical features in several of the companies’ target markets which include the telecommunications, server, mass storage, medical imaging, automatic test equipment (ATE), […]