PCBeam™ contact technology offers engineers design versatility featuring fine pitch and low profile options as well as high performance, rugged interconnects for Board-to-Board, Flex-to-Board and Device-to-Board applications.

PROCESS

The PCBeam™ manufacturing process utilizes photolithography, plating, and etching processes, as well as structural materials from the printed circuit board (PCB) and flexible printed circuit (FPC) industries. Sheets of metallic contact beams are defined in their ultimate array configuration using a large format lithography and etching process to create the 3D “PCBeam” contact array. The contact sheets are integrated into interposer structures comprised of high performance PCB materials using lamination, plating, and etching processes.

FEATURES
· PCB based for flexibility in thickness, shape & size
· Ultra-low profile to 0.28mm
· High volume manufacturability
· Superior shock & vibration to 1500g’s
· High current capacity
· Choose from standard, custom, or semi-custom
· High speed 56+Gbps, power & shielding

 

 

 

PCBeam™ PRODUCTS
PCBeam™ LPM Product Family Overview
PCBeam™ LPS Product Family Overview
PCBeam™ SPH1 Product Family
PCBeam™ SPH2 Product Family
TI DLP® Technology Interposer Products
Custom Products
LGA Sockets
High Speed Connectors