OVERVIEW

The PCBeam™ 54 Position Connector is an ultra-low-profile interconnect solution for the Texas Instruments DLP230GP (S246 DMD) for use in low-power/ low-lumen applications requiring minimal Z-Axis height*. This Interposer’s incredibly low 0.43mm (0.017”) mated height is approximately a 75% reduction in height as compared to legacy DMD interconnect solutions.

This one-piece, high density and cost-effective solution is enabled by Neoconix’s patented PCBeam™ technology that has a variable core thickness to provide an ultra-low-profile height without affecting the working range of the contacts. The integrated hole/slot alignment features have been further enhanced to compensate for the elimination of embedded alignment pins. These features allow for precise location of the Interposers to the DMD and main PC Board. The bifurcated contact design enhances the product reliability by providing an aggressive wiping during assembly.

*Consult TI for application suitability

FEATURES

· High density 0.7424mm area-array pitch
· Ultra-Low profile, 0.43 mm mated height
· PCBeam™ high reliability LGA spring contacts
· Bifurcated contact tips
· Single piece frame for improved dimensional tolerances
· Hard gold-plated contact interface
· RoHS 2011/65/EU (RoHS2) compliant
 

 

 

 

 

 

 

 

Downloadable Product Documents

Drawings
Request 3D File
Product Specs and Application Notes