• 1. What are the advantages of the Neoconix connector?
    • Neoconix connectors are fully configurable and may be tailored to each customer requirement. Our lithography based patterning allows for customization without the lead time and cost constraints of hard tooled conventional connectors.
    • Lithographic manufacturing processes allow significant miniaturization in x,y and z axis resulting in the smallest and thinnest connectors available in the market.
    • Our unique designs and low profile result in some of the highest speed connectors, capable of >25Gbps data rate per differential pair.
  • 2. What configurations are available?
    • LGA/LGA (Springs on both sides to mate to LGA pads)
    • LGA/BGA (Springs on one side with solder balls on the other side allowing SMT of the connector to one of the mating surfaces)
    • LGA/PAD (Springs on one side with either ENIG or flash-gold plated pads on the other side allowing options such as discrete wire soldering or SMT soldering of components to the Neoconix connector
  • 3. What are some of the best applications for the Neoconix connector?
    •  Battery Connectors: Neoconix interposers offer the highest current density (amps/mm²) of any connector in the world. Additionally, our patented structure allows for ganged power pins (lower resistance in parallel) and ground pins (improved EMI shielding).
    • FPC Jumpers & Small Footprint Applications: Neoconix interposers offer the highest pin count density in the world (pins/mm²). This minimizes the overall PCB footprint and significantly shrinks the width of FPC jumpers when used on both ends.
    • Ultra Low Profile: Neoconix offers interposers as thin as 0.20mm with a total stack below 1mm (including FPC assembly and screws).
    • Wire Routing Applications: The unique Neoconix interposer allows for re-routing of top and bottom pin assignments since our central core can use a multilayer PCB structure.
    • High Speeds: Neoconix interposers can be tailored specifically for customer requirements. Signal pins can be fully isolated with surrounding ground pins and pitches fully customizable (X & Y) to minimize cross talk. Additionally, our pin profile and plating can be adjusted to target a specific speed or frequency.
  • 4. What options are customizable?
    • Neoconix offers maximum flexibility with customizable shape, footprint, thickness, pin profile, and pitch.
  • 5. What are your standard pitches?
    • 1.27mm, 1.0mm, 0.8mm, and 0.74mm pitch arrays are tooled and readily available. Any other pitch can be custom made at a fraction of the cost of traditional connectors.
  • 6. What is the minimum pitch available?
    • Currently, the minimum pitches are 0.74mm array pitch or 0.5mm linear pitch. Our near-term roadmap includes 0.65mm array pitch.
  • 7. Do you have any standard products available?
    • Yes. We currently offer a variety of standard board to board, flex to board, and battery connectors. Please refer to the ‘Standard Products’ section of the website.
  • 8. What are the smallest and largest footprints available?
    • Neoconix currently ships connector and socket solutions from 2 to >5000 contacts in volume production.
  • 9. What is the minimum thickness available?
    • Our ultra-low profile products are currently available as thin as 0.20mm.
  • 10. What is the range of thicknesses available?
    • Our standard thickness range is from 0.5mm to 4.0mm.
    • We offer ultra low profile configurations down to 0.20mm.
  • 11. Are the interposers RoHS and REACH compliant?
    • Yes. All interposers are RoHS and REACH compliant. Certification documents are available upon request.
  • 12. Do the connectors have conflict-free metal certification?
    • Yes. All connectors use conflict free metal suppliers. Certification documents are available upon request.
  • 13. What is the flame rating?
    • PCBeam™: Standard design is halogen free and unrated, UL94V-1 option available for non-halogen free versions.
    • X-Beam™: UL94V-1
  • 14. How many mating cycles are allowed for standard products?
    • Standard products guarantee 50 mating cycles under standard operating and storage conditions.
    • We can custom design your connector to significantly increase mating cycles to > 10,000 cycles.
  • 15. What environmental testing has been performed?
    • Primary stress testing is per EIA-364, Electrical Connector Test Procedures
    • For further details, Neoconix offers Product Specifications for LPM, PCBeam™  & X-Beam™ product families
    • Typical tests performed;
      • Temperature Life per EIA 364-17B Test Condition 4F
      • Accelerated Thermal Cycling per EIA 364-32C
      • Thermal Shock per EIA 364-32,
      • Salt Spray per EIA 364-26B Test Condition A
  • 16. What is the maximum operating temperature?
    • LPM: -40⁰C to 85⁰C
    • SPH1: -40⁰C to 105⁰C
    • X-Beam™: -40⁰C to 85⁰C
    • Consult Neoconix on applications >105⁰C
  • 17. Do the mating pads need gold plating?
    • Yes, for LGA/LGA products. Hard gold and immersion gold are both acceptable.
    • CuOSP is acceptable for the BGA side of our LGA/BGA products.
  • 18. What is the lead time for prototypes? Mass production?
    • Prototype : 4-6 weeks (standard pitch)
    • Mass Production: 8-10 weeks
  • 19. What is the highest speed available?
    • We have released production products running at 28Gbps with on-going development for up to 56Gbps.
  • 20. What is the typical contact deflection and minimum deflection required?
    • 0.74 & 0.8 mm Pitch: 0.18mm per side, 0.04mm minimum deflection per side required
    • 1.0 mm Pitch: 0.20 mm per side, 0.06mm minimum deflection per side required
    • 1.27mm Pitch 0.25mm per side, 0.06mm minimum deflection per side required
  • 21. What is the average resistance per contact?
    • 10-30 mΩ per position
  • 22. How is the shock & vibe performance?
    • Dual compressive spring designs provided by Neoconix are inherently resistant to external shock and vibration loads which makes them ideal for hand-held or rugged application devices.
    • Shock per EIA 364-27B Test Condition A, 50g, 3-axis
    • Random Vibration per EIA 364-28, Test Condition V Letter A and B
    • Consult Neoconix Product Family Specifications for further details.