Engineered specifically for high speed, the DLBeam™ construction offers enhanced signal integrity for applications up to 56Gbps. Utilizing a modified design and manufacturing flow, DLBeam products take advantage of 60% less surface area to significantly reduce parasitic capacitance. The design also features a shorter, more direct signal path to minimize attenuation.
The DLBeam interposer construction is offered at 1mm pitch or greater. DLBeam products are offered in thicknesses from 0.75mm – 3.5mm and with LGA/LGA or LGA/BGA configuration. Coreless DLBeam option has a standard thickness of 0.45mm, with capability to 0.30mm, and is offered in LGA/LGA configuration.


DLBeam designs at 1mm pitch or greater
Up to 70% less insertion loss vs. standard PCBeam at 20GHz
Ultra-low profile capability as low as 0.30mm (coreless option)
Thickness up to 3.5mm
Current capacity to >2A per single position
Separable (LGA/LGA) or solderable (LGA/BGA) mounting options
Mechanically interchangeable with standard PCBeam interposers (no hardware changes needed if migrating to DLBeam)
Compliant with ROHS 2011/65/EU and IPC-4101B (halogen-free)

PCBeam™ Standard Construction

DLBeam™ Construction

Ultra-Thin Coreless Construction


Downloadable Product Documents:
Technology Overview