August 2009 – Neoconix to Present at SMTA International 2009

SUNNYVALE, CA August 11, 2009 – Neoconix will be presenting a new white paper at SMTA International 2009. Titled “Assessing Design Tradeoffs with a Customizable Area-Array Connector,” the presentation will discuss ways to influence the mechanical and electrical properties of connectors by taking advantage of the greatly expanded design

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January 2008 – Neoconix Partners with Molex on High-Density and Speed Electrical Interconnect

SUNNYVALE, CA January 21st, 2008 – Neoconix and Molex have partnered to deliver a flexible, copper-based high-density and speed (HD&S) electrical interconnect. The low-profile interconnect integrates Neoconix’s PCBeamTM-based interposer with Molex’s Copper Flex technology.

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