Neoconix connectors are fully configurable and may be tailored to each customer requirement. Our lithography based patterning allows for customization without the lead time and cost constraints of hard tooled conventional connectors.
Lithographic manufacturing processes allow significant miniaturization in x,y and z axis resulting in the smallest and thinnest connectors available in the market.
Our unique designs and low profile result in some of the highest speed connectors, capable of >25Gbps data rate per differential pair.
Battery Connectors: Neoconix interposers offer the highest current density (amps/mm²) of any connector in the world. Additionally, our patented structure allows for ganged power pins (lower resistance in parallel) and ground pins (improved EMI shielding).
FPC Jumpers & Small Footprint Applications: Neoconix interposers offer the highest pin count density in the world (pins/mm²). This minimizes the overall PCB footprint and significantly shrinks the width of FPC jumpers when used on both ends.
Ultra Low Profile: Neoconix offers interposers as thin as 0.20mm with a total stack below 1mm (including FPC assembly and screws).
Wire Routing Applications: The unique Neoconix interposer allows for re-routing of top and bottom pin assignments since our central core can use a multilayer PCB structure.
High Speeds: Neoconix interposers can be tailored specifically for customer requirements. Signal pins can be fully isolated with surrounding ground pins and pitches fully customizable (X & Y) to minimize cross talk. Additionally, our pin profile and plating can be adjusted to target a specific speed or frequency.