OVERVIEW
This one-piece, high density connector product was developed specifically for the Texas Instruments Series 310 DMD. Featuring Neoconix’s patented PCBeam™ interconnect technology, this product offers high performance and high reliability in an extremely compact form actor. Solder balls are pre-attached for ease of assembly onto the target flex circuit or rigid circuit board.

FEATURES
· High density 0.7424mmm area-array pitch
· Low profile, 1.06mm mated height
· PCBeam™ high reliability LGA Spring contacts
· Hard Gold-plated contact interface to DMD
· Standard SMT assembly
· ROHS 2011/65/EU compliant
· IPC-4101B compliant(halogen-free)

Downloadable Product Documents
Drawings
Product Specs and Application Notes