OVERVIEW
Featuring Neoconix’s patented PCBeam™ interconnect technology, this one-piece connector product offers high performance and high reliability in an extremely compact form factor. Compressible foam is used on the top and bottom side of the part to protect the contact beams at the unmated state, and foam flaps are used for part alignment.

FEATURES
· High density 0.7424mmm area-array pitch
· Low profile, 1.60mm mated height
· PCBeam™ high reliability LGA spring contact interface
· Hard Gold-plated contact interface
· Compressible foam protective outer layers
· IPC-4101B compliant(halogen-free)
· ROHS 2011/65/EU Compliant

 

Downloadable Product Documents
Drawings
Product Specs and Application Notes