|Engineered for Enhanced Signal Integrity
Engineered specifically for high speed, the new DLBeam™ construction offers enhanced signal integrity for applications up to 56Gbps. Utilizing a modified design and manufacturing flow, DLBeam™ products take advantage of 60% less surface area to significantly reduce parasitic capacitance. The design also features a shorter, more direct signal path to minimize attenuation.
The new DLBeam™ interposer construction can be applied to PCBeam connector products at 1mm pitch and higher, and will scale to finer pitches in the future.
|PCBeam™ Standard Construction
Coreless DLBeam™ Construction