June 2012 – Neoconix Launches Mobile Market Connectors

SUNNYVALE, CA June 6, 2012 – Neoconix today announced immediate availability of its new compression connector products specifically targeted at mobile electronics applications such as notebooks, digital still cameras, tablets and mobile phonehandsets. 

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January 2012 – Neoconix Launches 5-Row Standard Interposer Products

Neoconix has announced immediate availability of its new SPH1 family of compression connector products for flex-to-board and board-to-board applications. Utilizing PCBeam™ connector technology, these products combine high density and high reliability with outstanding electrical performance.

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March 2010 – Neoconix Featured in Advancing Microelectronics

Neoconix’s PCBeam ™ Technology is presented in the feature article of the March/April publication of Advancing Microelectronics magazine.

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January 2010 – High Volume Manufacturing Site in China Now Shipping to Top Tier Customers

SUNNYVALE, CA January 5, 2011 – Neoconix announced today that their high volume manufacturing site in Shenzhen, China has been fully qualified. The Shenzhen plant is now shipping multiple connector products to leading OEMs for computing and mobile consumer products.

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September 2009 – Neoconix Releases Low-Profile LGA1366 Socket

Neoconix has teamed up with Intel to develop a low-profile socket alternative for Intel’s Jasper Forest family of processors based on the Nehalem-EP architecture. Neoconix’ new socket allows Intel’s customers to maximize the performance and power advantages of this new architecture.

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