January 2012 – Neoconix Launches 5-Row Standard Interposer Products

Neoconix has announced immediate availability of its new SPH1 family of compression connector products for flex-to-board and board-to-board applications. Utilizing PCBeam™ connector technology, these products combine high density and high reliability with outstanding electrical performance.

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March 2010 – Neoconix Featured in Advancing Microelectronics

Neoconix’s PCBeam ™ Technology is presented in the feature article of the March/April publication of Advancing Microelectronics magazine.

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January 2010 – High Volume Manufacturing Site in China Now Shipping to Top Tier Customers

SUNNYVALE, CA January 5, 2011 – Neoconix announced today that their high volume manufacturing site in Shenzhen, China has been fully qualified. The Shenzhen plant is now shipping multiple connector products to leading OEMs for computing and mobile consumer products.

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September 2009 – Neoconix Releases Low-Profile LGA1366 Socket

Neoconix has teamed up with Intel to develop a low-profile socket alternative for Intel’s Jasper Forest family of processors based on the Nehalem-EP architecture. Neoconix’ new socket allows Intel’s customers to maximize the performance and power advantages of this new architecture.

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August 2009 – Neoconix to Present at SMTA International 2009

SUNNYVALE, CA August 11, 2009 – Neoconix will be presenting a new white paper at SMTA International 2009. Titled “Assessing Design Tradeoffs with a Customizable Area-Array Connector,” the presentation will discuss ways to influence the mechanical and electrical properties of connectors by taking advantage of the greatly expanded design

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